SBVS455
April 2024
TLV772
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Dropout Voltage
6.3.2
Active Discharge
6.3.3
Foldback Current Limit
6.3.4
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Normal Operation
6.4.2
Dropout Operation
6.4.3
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Recommended Capacitor Types
7.1.2
Input and Output Capacitor Requirements
7.2
Typical Application
7.2.1
Application
7.2.2
Design Requirements
7.2.3
Detailed Design Procedure
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Examples
8
Device and Documentation Support
8.1
Device Support
8.1.1
Device Nomenclature
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DBV|5
MPDS018T
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbvs455_oa
8.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.