SBVS424C December   2023  – October 2024 TLV773

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DQN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision B (May 2024) to Revision C (October 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed all dropout test conditionsGo
  • Changed dropout maximum specification for 2.8V ≤ VOUT ≤ 3.3V, DBVGo
  • Changed dropout maximum specification for 2.8V ≤ VOUT ≤ 3.3V, DQNGo
  • Changed dropout maximum specification for 2.8V ≤ VOUT ≤ 3.3V, DBVGo
  • Changed dropout maximum specification for 2.8V ≤ VOUT ≤ 3.3V, DQNGo

Changes from Revision A (April 2024) to Revision B (May 2024)

  • Changed High PSRR bullet in Features Go
  • Changed operating junction temperature range from −40°C to +85°C to −40°C to +125°C throughout documentGo
  • Changed VIN Absolute Maximum RatingGo
  • Changed VEN Absolute Maximum RatingGo
  • Changed Operating junction temperatureGo
  • Added footnote explaining dropout and headroomGo
  • Added PSRR at f = 217Hz and 1kHzGo
  • Changed IOUT range from 0mA to 300mA to 1mA to 300mA in Load Transient curves of Typical Characteristics Go