SNOSDA3F June 2020 – March 2023 TLV9020 , TLV9021 , TLV9022 , TLV9024 , TLV9030 , TLV9031 , TLV9032 , TLV9034
PRODMIX
THERMAL METRIC (1) | TLV90x2 | UNIT | |||||
---|---|---|---|---|---|---|---|
D (SOIC) |
PW (TSSOP) |
DGK (VSSOP) |
DSG (WSON) |
DDF (SOT-23) |
|||
8 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | |||
RqJA | Junction-to-ambient thermal resistance | 167.7 | 221.7 | 215.8 | 175.2 | 240.0 | °C/W |
RqJC(top) | Junction-to-case (top) thermal resistance | 107.0 | 109.1 | 105.2 | 178.1 | 151.0 | °C/W |
RqJB | Junction-to-board thermal resistance | 111.2 | 152.5 | 137.5 | 139.5 | 157.0 | °C/W |
yJT | Junction-to-top characterization parameter | 53.1 | 36.4 | 39.6 | 47.2 | 32.8 | °C/W |
yJB | Junction-to-board characterization parameter | 110.4 | 150.7 | 135.9 | 138.9 | 155.4 | °C/W |
RqJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | – | 127.3 | – | °C/W |