SBOS836G
March 2020 – March 2022
TLV9041
,
TLV9042
,
TLV9044
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information for Single Channel
7.5
Thermal Information for Dual Channel
7.6
Thermal Information for Quad Channel
7.7
Electrical Characteristics
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Operating Voltage
8.3.2
Rail-to-Rail Input
8.3.3
Rail-to-Rail Output
8.3.4
Common-Mode Rejection Ratio (CMRR)
8.3.5
Capacitive Load and Stability
8.3.6
Overload Recovery
8.3.7
EMI Rejection
8.3.8
Electrical Overstress
8.3.9
Input and ESD Protection
8.3.10
Shutdown Function
8.3.11
Packages With an Exposed Thermal Pad
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
TLV904x Low-Side, Current Sensing Application
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DPW|5
MPSS088
DCK|5
MPDS025J
DBV|5
MPDS018T
DBV|6
MPDS026Q
Thermal pad, mechanical data (Package|Pins)
DPW|5
QFND567C
Orderable Information
sbos836g_oa
sbos836g_pm
12.5
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.