SBOS836G March   2020  – March 2022 TLV9041 , TLV9042 , TLV9044

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Thermal Information for Quad Channel
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Operating Voltage
      2. 8.3.2  Rail-to-Rail Input
      3. 8.3.3  Rail-to-Rail Output
      4. 8.3.4  Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5  Capacitive Load and Stability
      6. 8.3.6  Overload Recovery
      7. 8.3.7  EMI Rejection
      8. 8.3.8  Electrical Overstress
      9. 8.3.9  Input and ESD Protection
      10. 8.3.10 Shutdown Function
      11. 8.3.11 Packages With an Exposed Thermal Pad
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV904x Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4.     Trademarks
    5. 12.4 Electrostatic Discharge Caution
    6. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7 EMI Rejection

The TLV904x uses integrated electromagnetic interference (EMI) filtering to reduce the effects of EMI from sources such as wireless communications and densely-populated boards with a mix of analog signal chain and digital components. EMI immunity can be improved with circuit design techniques; the TLV904x benefits from these design improvements. Texas Instruments has developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10 MHz to 6 GHz. Figure 8-4 shows the results of this testing on the TLV904x. Table 8-1 shows the EMIRR IN+ values for the TLV904x at particular frequencies commonly encountered in real-world applications. The EMI Rejection Ratio of Operational Amplifiers application report contains detailed information on the topic of EMIRR performance as it relates to op amps and is available for download from www.ti.com.

GUID-20201008-CA0I-7L1B-3NLW-L8TB88PLDZ3P-low.gif Figure 8-4 EMIRR Testing
Table 8-1 TLV904x EMIRR IN+ for Frequencies of Interest
FREQUENCYAPPLICATION OR ALLOCATIONEMIRR IN+
400 MHzMobile radio, mobile satellite, space operation, weather, radar, ultra-high frequency (UHF) applications60 dB
900 MHzGlobal system for mobile communications (GSM) applications, radio communication, navigation, GPS (to 1.6 GHz), GSM, aeronautical mobile, UHF applications70 dB
1.8 GHzGSM applications, mobile personal communications, broadband, satellite, L-band (1 GHz to 2 GHz)75 dB
2.4 GHz802.11b, 802.11g, 802.11n, Bluetooth®, mobile personal communications, industrial, scientific and medical (ISM) radio band, amateur radio and satellite, S-band (2 GHz to 4 GHz)79.0 dB
3.6 GHzRadiolocation, aero communication and navigation, satellite, mobile, S-band82 dB
5 GHz802.11a, 802.11n, aero communication and navigation, mobile communication, space and satellite operation, C-band (4 GHz to 8 GHz)85 dB