SBOS836G March   2020  – March 2022 TLV9041 , TLV9042 , TLV9044

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Thermal Information for Quad Channel
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Operating Voltage
      2. 8.3.2  Rail-to-Rail Input
      3. 8.3.3  Rail-to-Rail Output
      4. 8.3.4  Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5  Capacitive Load and Stability
      6. 8.3.6  Overload Recovery
      7. 8.3.7  EMI Rejection
      8. 8.3.8  Electrical Overstress
      9. 8.3.9  Input and ESD Protection
      10. 8.3.10 Shutdown Function
      11. 8.3.11 Packages With an Exposed Thermal Pad
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV904x Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4.     Trademarks
    5. 12.4 Electrostatic Discharge Caution
    6. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The low-power TLV904x family includes single (TLV9041), dual (TLV9042), and quad-channel (TLV9044) ultra-low-voltage (1.2 V to 5.5 V) operational amplifiers (op-amps) with rail-to-rail input and output swing capabilities. The TLV904x enables power savings both with its low quiescent current (10 µA, typ.) and the ability to operate at supply voltages as low as 1.2 V, making it one of the few amplifiers in the industry capable of 1.5-V coin cell applications. Further power savings can be achieved using the shutdown mode (TLV9041S, TLV9042S, and TLV9044S) that allows the amplifiers to be switched off and enter into a standby mode with typical current consumption of less than 150 nA. These devices offer a cost-effective amplifier solution for power and space-constrained applications such as battery-powered IoT devices, wearable electronics, and personal electronics where low-voltage operation is crucial.

The robust design of the TLV904x family simplifies circuit design. These op-amps feature an integrated RFI and EMI rejection filter, unity-gain stability, and no-phase reversal in input overdrive conditions. The device also delivers excellent AC performance with a gain bandwidth of 350 kHz and a high cap load drive of 100 pF, enabling designers to achieve both improved performance and lower power consumption.

Space-saving micro-size packages, such as X2QFN and WSON, are offered for all channel variants (single, dual, and quad), along with industry-standard packages such as SOIC, VSSOP, TSSOP, and SOT-23 packages.

Device Information
PART NUMBER(1)(2) PACKAGE BODY SIZE (NOM)
TLV9041 SOT-23 (5) 1.60 mm × 2.90 mm
SC70 (5) 1.25 mm × 2.00 mm
X2SON (5) 0.80 mm × 0.80 mm
TLV9041S SOT-23 (6) 1.60 mm × 2.90 mm
TLV9042 SOIC (8) 3.91 mm × 4.90 mm
SOT-23 (8) 1.60 mm × 2.90 mm
WSON (8) 2.00 mm × 2.00 mm
VSSOP (8) 3.00 mm × 3.00 mm
TSSOP (8) 3.00 mm × 4.40 mm
TLV9042S X2QFN (10) 1.50 mm × 2.00 mm
TLV9044 SOIC (14) 8.65 mm × 3.91 mm
TSSOP (14) 4.40 mm × 5.00 mm
SOT-23 (14) 4.20 mm × 1.90 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) Other single and dual channel package variants will release shortly.
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