SBOS943E February   2019  – August 2021 TLV9101 , TLV9102 , TLV9104

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  EMI Rejection
      2. 7.3.2  Phase Reversal Protection
      3. 7.3.3  Thermal Protection
      4. 7.3.4  Capacitive Load and Stability
      5. 7.3.5  Common-Mode Voltage Range
      6. 7.3.6  Electrical Overstress
      7. 7.3.7  Overload Recovery
      8. 7.3.8  Typical Specifications and Distributions
      9. 7.3.9  Packages With an Exposed Thermal Pad
      10. 7.3.10 Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High Voltage Precision Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (June 2021) to Revision E (August 2021)

  • Removed preview notation from TLV9102 VSSOP (8) package from Device Information tableGo
  • Removed preview notation from TLV9102 VSSOP-8 (DGK) package in the Pin Configuration and Functions sectionGo
  • Removed preview note and added thermal data for VSSOP-8 (DGK) package in Thermal Information for Dual Channel. Go
  • Added clarifying statement regarding logic low signal for SHDN pin in the Shutdown section Go
  • Corrected statement on shutdown enable and disable times in the Shutdown section from 30 μs and 3 μs to 11 μs and 2.5 μs, respectively, to match the Electrical Characteristics sectionGo

Changes from Revision C (May 2020) to Revision D (June 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed preview notation from TLV9104 SOIC (14) package from Device Information tableGo
  • Removed preview notation from TLV9104 TSSOP (14) package from Device Information tableGo
  • Removed preview notation from TLV9102 SOT-23 (8) package from Device Information tableGo
  • Removed preview notation from TLV9104 WQFN (16) package from Device Information tableGo
  • Removed preview notation from TLV9101 DBV package (SOT-23) in the Pin Configuration and Functions sectionGo
  • Adjusted DRL pinout in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9101 DCK package (SC70) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9101S DBV package (SOT-23) in the Pin Configuration and Functions sectionGo
  • Clarified shutdown notation in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9102 DDF package (SOT-23-8) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9104 SOIC (D) and TSSOP (PW) packages in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9104 X2QFN (RUC) package in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9104 WQFN (RTE) package in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9104S WQFN (RTE) package in the Pin Configuration and Functions sectionGo
  • Removed Table of Graphs from the Specifications sectionGo
  •  Removed preview note from WQFN (RTE) package in thermal information for quad channel.Go
  • Removed Related Links section from the Device and Documentation Support sectionGo

Changes from Revision B (May 2020) to Revision C (May 2020)

  • Removed preview notation from TLV9102 VSSOP (10) package from Device Information tableGo
  • Removed preview notation from TLV9102 X2QFN (10) package from Device Information tableGo
  • Removed preview notation from TLV9102 DGS package (VSSOP) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9102 RUG package (X2QFN) in the Pin Configuration and Functions sectionGo

Changes from Revision A (April 2019) to Revision B (May 2020)

  • Changed the TLV9101 and TLV9104 device statuses from Advance Information to Production Data Go
  • Removed preview notation from TLV9101 SOT-23 (5) package from Device Information tableGo
  • Removed preview notation from TLV9101 SOT-23 (6) package from Device Information tableGo
  • Removed preview notation from TLV9101 SC70 (5) package from Device Information tableGo
  • Removed preview notation from TLV9102 TSSOP (8) package from Device Information tableGo
  • Removed preview notation from TLV9102 WSON (8) package from Device Information tableGo
  • Removed preview notation from TLV9102 DSG package (WSON) in the Pin Configuration and Functions sectionGo
  • Added SHUTDOWN to Electrical Characteristics Go
  • Added Packages With an Exposed Thermal Pad to the Feature Description Go

Changes from Revision * (February 2019) to Revision A (April 2019)

  • Changed the TLV9102 device status from Advance Information to Production Data Go
  • Removed preview notation from TLV9102 SOIC (8) package from Device Information tableGo