SBOS943E February 2019 ā August 2021 TLV9101 , TLV9102 , TLV9104
PRODUCTION DATA
The TLV910x family is available in packages such as the WSON-8 (DSG) and WQFN-16 (RTE), which feature an exposed thermal pad. Inside the package, the die is attached to this thermal pad using an electrically conductive compound. For this reason, when using a package with an exposed thermal pad, the thermal pad must either be connected to Vā or left floating. Attaching the thermal pad to a potential other than Vā is not allowed, and performance of the device is not assured when doing so.