SBOSA23G
May 2020 – March 2024
TLV9151-Q1
,
TLV9152-Q1
,
TLV9154-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information for Single Channel
5.5
Thermal Information for Dual Channel
5.6
Thermal Information for Quad Channel
5.7
Electrical Characteristics
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
EMI Rejection
6.3.2
Thermal Protection
6.3.3
Capacitive Load and Stability
6.3.4
Common-Mode Voltage Range
6.3.5
Phase Reversal Protection
6.3.6
Electrical Overstress
6.3.7
Overload Recovery
6.3.8
Typical Specifications and Distributions
6.3.9
Shutdown
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Applications
7.2.1
Low-Side Current Measurement
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.1.1.1
TINA-TI (Free Software Download)
8.1.1.2
TI Precision Designs
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DYY|14
MPSS114C
PW|14
MPDS360A
D|14
MPDS177H
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbosa23g_oa
sbosa23g_pm
7.4.2
Layout Example
Figure 7-3
Schematic Representation
Figure 7-4
Operational Amplifier Board Layout for Noninverting Configuration