SBOSA23G May   2020  – March 2024 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 EMI Rejection
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Capacitive Load and Stability
      4. 6.3.4 Common-Mode Voltage Range
      5. 6.3.5 Phase Reversal Protection
      6. 6.3.6 Electrical Overstress
      7. 6.3.7 Overload Recovery
      8. 6.3.8 Typical Specifications and Distributions
      9. 6.3.9 Shutdown
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5.     Trademarks
    6. 8.5 Electrostatic Discharge Caution
    7. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, VS = ±8 V, VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2, and CL = 10 pF (unless otherwise noted)

GUID-82E9D7A5-B27E-428D-A6A8-C33A900E0DE1-low.gif
Distribution from 15462 amplifiers, TA = 25°C
Figure 5-1 Offset Voltage Production Distribution
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VCM = V+
Figure 5-3 Offset Voltage vs Temperature
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TA = 25°C
Figure 5-5 Offset Voltage vs Common-Mode Voltage
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TA = 125°C
Figure 5-7 Offset Voltage vs Common-Mode Voltage
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Figure 5-9 Offset Voltage vs Power Supply
GUID-41BB3A10-3040-42EB-B020-B6B711B598A0-low.gifFigure 5-11 Closed-Loop Gain vs Frequency
GUID-711A804C-9964-4ED7-9A16-25C5E397F365-low.gifFigure 5-13 Input Bias Current vs Temperature
GUID-9AF8D493-4896-40C2-B391-5F4D5B3E487F-low.gif
Figure 5-15 Output Voltage Swing vs Output Current (Sinking)
GUID-1DCBAD9B-A6FB-46C4-AECF-D61655B0E9F7-low.gif
f = 0 Hz
Figure 5-17 CMRR vs Temperature (dB)
GUID-FD5CEC25-2041-4675-9622-4CA7D378F4C6-low.gifFigure 5-19 0.1-Hz to 10-Hz Noise
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BW = 80 kHz, VOUT = 1 VRMS
Figure 5-21 THD+N Ratio vs Frequency
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VCM = V–
Figure 5-23 Quiescent Current vs Supply Voltage
GUID-94C2D91D-8F64-47B1-91F2-E3ACB85BE643-low.gifFigure 5-25 Open-Loop Voltage Gain vs Temperature (dB)
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G = –1, 10-mV output step
Figure 5-27 Small-Signal Overshoot vs Capacitive Load
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Figure 5-29 Phase Margin vs Capacitive Load
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G = –10
Figure 5-31 Positive Overload Recovery
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CL = 20 pF, G = 1, 20-mV step response
Figure 5-33 Small-Signal Step Response, Rising
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CL = 20 pF, G = 1
Figure 5-35 Large-Signal Step Response (Rising)
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CL = 20 pF, G = –1
Figure 5-37 Large-Signal Step Response
GUID-5832F5D4-4E06-4A4D-9D72-265D59C071BC-low.gifFigure 5-39 Maximum Output Voltage vs Frequency
GUID-6ACF97D4-7453-4DF5-8C6D-97923A0A7302-low.gifFigure 5-41 EMIRR (Electromagnetic Interference Rejection Ratio) at Inputs vs Frequency
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Distribution from 60 amplifiers
Figure 5-2 Offset Voltage Drift Distribution
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VCM = V–
Figure 5-4 Offset Voltage vs Temperature
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TA = 25°C
Figure 5-6 Offset Voltage vs Common-Mode Voltage (Transition Region)
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TA = –40°C
Figure 5-8 Offset Voltage vs Common-Mode Voltage
GUID-C7DAE225-E49F-4F72-9C48-04369F89FD9D-low.gif
CL = 20 pF
Figure 5-10 Open-Loop Gain and Phase vs Frequency
GUID-E254C800-50DB-45AD-8FB8-8AF64480E664-low.gifFigure 5-12 Input Bias Current vs Common-Mode Voltage
GUID-FFF131F2-5E36-4882-8E30-DBABA694DCCE-low.gifFigure 5-14 Output Voltage Swing vs Output Current (Sourcing)
GUID-1B348DD6-8FD9-46DA-ABF6-48E3DBDCFC2C-low.gif
Figure 5-16 CMRR and PSRR vs Frequency
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f = 0 Hz
Figure 5-18 PSRR vs Temperature (dB)
GUID-E2D7EBFF-273A-4F29-9D20-D1E01D6A5AF4-low.gifFigure 5-20 Input Voltage Noise Spectral Density vs Frequency
GUID-EACC3D3B-E7DF-41F7-B007-729C7E001AB2-low.gif
BW = 80 kHz, f = 1 kHz
Figure 5-22 THD+N vs Output Amplitude
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Figure 5-24 Quiescent Current vs Temperature
GUID-6DD14887-5CC4-4A9C-8A31-17C9C5C387FA-low.gifFigure 5-26 Open-Loop Output Impedance vs Frequency
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G = 1, 10-mV output step
Figure 5-28 Small-Signal Overshoot vs Capacitive Load
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VIN = ±8 V; VS = VOUT = ±8 V
Figure 5-30 No Phase Reversal
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G = –10
Figure 5-32 Negative Overload Recovery
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CL = 20 pF, G = -1, 20-mV step response
Figure 5-34 Small-Signal Step Response
GUID-1F70A5A0-822A-4B7C-A7C7-E1C752AE0B8A-low.gif
CL = 20 pF, G = 1
Figure 5-36 Large-Signal Step Response (Falling)
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Figure 5-38 Short-Circuit Current vs Temperature
GUID-C04A03F3-BC86-4EE0-81F1-07D5C302A27A-low.gifFigure 5-40 Channel Separation vs Frequency