SBOSA23G May   2020  – March 2024 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 EMI Rejection
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Capacitive Load and Stability
      4. 6.3.4 Common-Mode Voltage Range
      5. 6.3.5 Phase Reversal Protection
      6. 6.3.6 Electrical Overstress
      7. 6.3.7 Overload Recovery
      8. 6.3.8 Typical Specifications and Distributions
      9. 6.3.9 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5.     Trademarks
    6. 8.5 Electrostatic Discharge Caution
    7. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision F (June 2023) to Revision G (March 2024)

  • Added the 6-pin SOT-23 (DBV) and 5-pin SC70 (DCK) packages throughout the data sheetGo
  • Added HBM ESD rating for TLV9151SQDBVRQ1Go
  • Added the Shutdown performance section to Electrical Characteristic tableGo
  • Added Shutdown section to the Feature Description Go

Changes from Revision E (March 2022) to Revision F (June 2023)

  • Changed the status of the (TSSOP, 14) package from: preview to: activeGo

Changes from Revision D (September 2021) to Revision E (March 2022)

  • Changed maximum PSRR (2.7 V to 16 V) from ±8µV/V to ±10.6µV/VGo
  • Changed minimum CMRR (at 16 V) from 100 dB to 99 dB Go

Changes from Revision C (May 2021) to Revision D (September 2021)

  • Deleted preview note from SOIC (14) package in Device Information tableGo
  • Deleted preview note from SOT-23 (14) package in Device Information tableGo
  • Deleted preview note from SOIC (8) package in Device Information tableGo
  • Deleted preview note from SOT-23 (5) package in Device Information tableGo
  • Deleted preview note from SOT-23 (14) Package, in Pin Configuration and Functions section.Go
  • Deleted preview note from SOIC (14) Package, in Pin Configuration and Functions section.Go
  • Deleted preview note from SOIC (8) Package, in Pin Configuration and Functions section.Go
  • Deleted preview note from SOT-23 (5) Package, in Pin Configuration and Functions section.Go

Changes from Revision B (March 2021) to Revision C (May 2021)

  • Deleted preview note from TSSOP (14) package in Device Information tableGo
  • Deleted preview note from TSSOP (14) Package, in Pin Configuration and Functions section.Go
  • Deleted preview note from PW package in Thermal Information for Quad Channel table. Go

Changes from Revision A (January 2021) to Revision B (March 2021)

  • Changed device status from Advance Information to Production Data Go
  • Deleted preview note from VSSOP (8) package in Device Information table.Go
  • Deleted preview note from VSSOP (8) Package, in Pin Configuration and Functions sectionGo