SBOSA23G May 2020 – March 2024 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1
PRODUCTION DATA
THERMAL METRIC (1) | TLV9151-Q1, TLV9151S-Q1 | UNIT | |||
---|---|---|---|---|---|
DBV (SOT-23) |
DCK (SC70) |
||||
5 PINS | 6 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 187.4 | 167.8 | 202.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 86.2 | 107.9 | 101.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 54.6 | 49.7 | 47.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 27.8 | 33.9 | 18.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 54.3 | 49.5 | 47.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |