SBOSA23G May 2020 – March 2024 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1
PRODUCTION DATA
THERMAL METRIC (1) | TLV9154-Q1 | UNIT | |||
---|---|---|---|---|---|
D (SOIC) |
DYY (SOT-23) |
PW (TSSOP) |
|||
14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 101.4 | 110.7 | 118.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 57.6 | 55.9 | 47.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 57.3 | 35.3 | 60.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 18.5 | 2.3 | 6.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 56.9 | 35.1 | 60.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |