SBOSA23G May   2020  – March 2024 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 EMI Rejection
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Capacitive Load and Stability
      4. 6.3.4 Common-Mode Voltage Range
      5. 6.3.5 Phase Reversal Protection
      6. 6.3.6 Electrical Overstress
      7. 6.3.7 Overload Recovery
      8. 6.3.8 Typical Specifications and Distributions
      9. 6.3.9 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5.     Trademarks
    6. 8.5 Electrostatic Discharge Caution
    7. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information for Dual Channel

THERMAL METRIC (1) TLV9152-Q1 Unit
D
(SOIC)		 DGK
(VSSOP)		 PW
(TSSOP)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 132.6 176.5 185.1   °C/W
RθJC(top) Junction-to-case (top) thermal resistance 73.4 68.1 74.0   °C/W
RθJB Junction-to-board thermal resistance 76.1 98.2 115.7   °C/W
ψJT Junction-to-top characterization parameter 24.0 12.0 12.3   °C/W
ψJB Junction-to-board characterization parameter 75.4 96.7 114.0   °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A   °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.