SBOS986E October   2019  – January 2022 TLV9151 , TLV9152 , TLV9154

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8.     14
    9. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  EMI Rejection
      2. 7.3.2  Thermal Protection
      3. 7.3.3  Capacitive Load and Stability
      4. 7.3.4  Common-Mode Voltage Range
      5. 7.3.5  Phase Reversal Protection
      6. 7.3.6  Electrical Overstress
      7. 7.3.7  Overload Recovery
      8. 7.3.8  Typical Specifications and Distributions
      9. 7.3.9  Packages With an Exposed Thermal Pad
      10. 7.3.10 Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (May 2021) to Revision E (January 2022)

  • Updated industry standard packages in Features to match the packages available in Device Information section Go
  • Added SOT-23-14 (DYY) package to Device Information Go
  • Added SOT-23-14 (DYY) package and pin functions in Pin Configurations and Functions sectionGo
  • Removed WQFN-14 (RTE) package and pin functions in Pin Configurations and Functions sectionGo
  • Removed WQFN-16 (RTE) package and pin functions in Pin Configurations and Functions sectionGo
  • Corrected typo mislabeling the RUC package as having an "Exposed Thermal Pad" in Pin Configurations and Functions sectionGo
  • Removed SOT-553 (DRL) package and pin functions from Pin Configurations and Functions sectionGo
  • Removed SOT-563 (DRL) package and pin functions from Pin Configurations and Functions sectionGo
  • Corrected typo in Recommended Operating Conditions which labeled VIH as amplifier enabled and VIL as amplifier disabled to correctly label VIH as amplifier disabled and VIL as amplifier enabledGo
  • Added SOT-23-14 (DYY) package in Thermal Information for Quad Channel sectionGo
  • Corrected typo mislabeling the RUC package as a "WQFN" package instead of as a "X2QFN" package in Thermal Information for Quad Channel sectionGo
  • Removed "TLV9154S" from header of Thermal Information for Quad Channel sectionGo
  • Maximum PSRR specification from VS = 4 V to 16 V changed from ±1 μV/V to ±1.6 μV/VGo
  • Maximum PSRR specification from VS = 2.7 V to 16 V changed from ±5 μV/V to ±8.64 μV/VGo
  • Minimum CMRR specification for VS = 16 V changed from 109dB to 99dBGo
  • Corrected typo in IQSD test conditions in Electrical Characteristics table from "SHDN = V–" to "SHDN = V– + 2 V"Go
  • Removed the overbar from the SHDN pin name in the note on toff and ton in the Electrical Characteristics section for consistencyGo
  • Updated Figure EMIRR Testing and Table TLV9151 EMIRR IN+ for Frequencies of Interest in EMI Rejection to match the increased performance from Figure EMIRR (Electromagnetic Interference Rejection Ratio) vs Frequency in Electrical Characteristics Go
  • Changed input resistor values in Equivalent Internal ESD Circuitry Relative to a Typical Circuit Application in Electrical Overstress section to more closely resemble device Go
  • Removed WQFN (RTE) package from Packages With an Exposed Thermal Pad Go
  • Expanded the Shutdown section in the Detailed Description section to further clarify shutdown operation and corrected the current consumption in shutdown from 20µA to 30µA and the "typical enable time" in the section from 30µs to 8µs to align with the Electrical Characteristics sectionGo

Changes from Revision C (December 2020) to Revision D (May 2021)

  • Changed VSSOP (8) package status on Device Information from Preview to Active Go
  • Removed preview notation on VSSOP-8 (DGK) package in Pin Configurations and Functions Go
  • Removed VSSOP-10 (DGS) package in Pin Configurations and Functions Go

Changes from Revision B (May 2020) to Revision C (December 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the document Go
  • Changed SOT-23 (5) package status on Device Information from Preview to Active Go
  • Changed SC70 (5) package status on Device Information from Preview to Active Go
  • Changed SOT-23 (6) package status on Device Information from Preview to Active Go
  • Changed SOT-23 (8) package status on Device Information from Preview to Active Go
  • Changed VSSOP (8) package status on Device Information from Preview to Active Go
  • Changed SOIC (14) package status on Device Information from Preview to Active Go
  • Changed TSSOP (14) package status on Device Information from Preview to Active Go
  • Changed X2QFN (14) package status on Device Information from Preview to Active Go
  • Removed preview notation on SOT-23-5 (DBV), SC70-5 (DCK) SOT-23-6 (DBV), and SOT-23-8 (DDF) packages in Pin Configurations and Functions Go
  • Removed preview notation on SOIC-14 (D) package in Pin Configurations and Functions Go
  • Removed preview notation on TSSOP-14 (PW) package in Pin Configurations and Functions Go
  • Removed preview notation on X2QFN-14 (RUC) package in Pin Configurations and Functions Go

Changes from Revision A (March 2020) to Revision B (May 2020)

  • Changed X2QFN (10) package status on Device Information from Preview to Active Go
  • Removed preview notation on X2QFN (RUG) package in Pin Configurations and Functions Go
  • Added VIH and VIL in Recommended Operating Conditions sectionGo
  • Added SHUTDOWN in Electrical Characteristics tableGo

Changes from Revision * (October 2019) to Revision A (March 2020)

  • Changed document status from Advance Information to Production Data Go
  • Changed SOIC (8) package status on Device Information from Preview to Active Go
  • Changed TSSOP (8) package status on Device Information from Preview to Active Go
  • Changed WSON (8) package status on Device Information from Preview to Active Go
  • Removed preview notation on SOIC-8 (D), TSSOP-8 (PW), and WSON-8 (DSG) packages in Pin Configurations and Functions Go
  • Added Typical Characteristics section in Specifications sectionGo