SBOSA68D
November 2021 – March 2024
TLV9161
,
TLV9162
,
TLV9164
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information for Single Channel
5.5
Thermal Information for Dual Channel
5.6
Thermal Information for Quad Channel
5.7
Electrical Characteristics
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Input Protection Circuitry
6.3.2
EMI Rejection
6.3.3
Thermal Protection
6.3.4
Capacitive Load and Stability
6.3.5
Common-Mode Voltage Range
6.3.6
Phase Reversal Protection
6.3.7
Electrical Overstress
6.3.8
Overload Recovery
6.3.9
Typical Specifications and Distributions
6.3.10
Packages With an Exposed Thermal Pad
6.3.11
Shutdown
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Applications
7.2.1
Low-Side Current Measurement
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curve
7.2.2
Buffered Multiplexer
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.1.1.1
TINA-TI (Free Software Download)
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DSG|8
MPDS308C
PW|8
MPDS568
RUG|10
MPQF216A
DGK|8
MPDS028E
DDF|8
MPDS569D
Thermal pad, mechanical data (Package|Pins)
DSG|8
QFND141I
Orderable Information
sbosa68d_oa
sbosa68d_pm
7.4.2
Layout Example
Figure 7-4
Schematic for Noninverting Configuration Layout Example
Figure 7-5
Operational Amplifier Board Layout for Noninverting Configuration - SC70 (DCK) Package