SBOSAD7A April   2023  – August 2024 TLV9161-Q1 , TLV9162-Q1 , TLV9164-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Protection Circuitry
      2. 6.3.2 EMI Rejection
      3. 6.3.3 Thermal Protection
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 Common-Mode Voltage Range
      6. 6.3.6 Phase Reversal Protection
      7. 6.3.7 Electrical Overstress
      8. 6.3.8 Overload Recovery
      9. 6.3.9 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.2 EMI Rejection

The TLV916x-Q1 uses integrated electromagnetic interference (EMI) filtering to reduce the effects of EMI from sources such as wireless communications and densely-populated boards with a mix of analog signal chain and digital components. EMI immunity can be improved with circuit design techniques; the TLV916x-Q1 benefits from these design improvements. Texas Instruments has developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10MHz to 6GHz. Figure 6-3 shows the results of this testing on the TLV916x-Q1. Table 6-1 provides the EMIRR IN+ values for the TLV916x-Q1 at particular frequencies commonly encountered in real-world applications. The EMI Rejection Ratio of Operational Amplifiers application report contains detailed information on the topic of EMIRR performance as it relates to op amps and is available for download from www.ti.com.

TLV9161-Q1 TLV9162-Q1 TLV9164-Q1 EMIRR Testing Figure 6-3 EMIRR Testing
Table 6-1 TLV9161-Q1 EMIRR IN+ for Frequencies of Interest
FREQUENCY APPLICATION OR ALLOCATION EMIRR IN+
400MHz Mobile radio, mobile satellite, space operation, weather, radar, ultra-high frequency (UHF) applications 50.0dB
900MHz Global system for mobile communications (GSM) applications, radio communication, navigation, GPS (to 1.6GHz), GSM, aeronautical mobile, UHF applications 56.3dB
1.8GHz GSM applications, mobile personal communications, broadband, satellite, L-band (1GHz to 2GHz) 65.6dB
2.4GHz 802.11b, 802.11g, 802.11n, Bluetooth®, mobile personal communications, industrial, scientific and medical (ISM) radio band, amateur radio and satellite, S-band (2GHz to 4GHz) 70.0dB
3.6GHz Radiolocation, aero communication and navigation, satellite, mobile, S-band 78.9dB
5GHz 802.11a, 802.11n, aero communication and navigation, mobile communication, space and satellite operation, C-band (4GHz to 8GHz) 91.0dB