SBOSAD7A April   2023  – August 2024 TLV9161-Q1 , TLV9162-Q1 , TLV9164-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Protection Circuitry
      2. 6.3.2 EMI Rejection
      3. 6.3.3 Thermal Protection
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 Common-Mode Voltage Range
      6. 6.3.6 Phase Reversal Protection
      7. 6.3.7 Electrical Overstress
      8. 6.3.8 Overload Recovery
      9. 6.3.9 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.1 Input Protection Circuitry

The TLV916x-Q1 uses a special input architecture to eliminate the requirement for input protection diodes but still provides robust input protection under transient conditions. Figure 6-1 shows conventional input diode protection schemes that are activated by fast transient step responses and introduce signal distortion and settling time delays because of alternate current paths, as shown in Figure 6-2. For low-gain circuits, these fast-ramping input signals forward-bias back-to-back diodes, causing an increase in input current and resulting in extended settling time.

TLV9161-Q1 TLV9162-Q1 TLV9164-Q1 TLV916x-Q1 Input Protection Does Not Limit Differential Input CapabilityFigure 6-1 TLV916x-Q1 Input Protection Does Not Limit Differential Input Capability
TLV9161-Q1 TLV9162-Q1 TLV9164-Q1 Back-to-Back Diodes Create Settling IssuesFigure 6-2 Back-to-Back Diodes Create Settling Issues

The TLV916x-Q1 family of operational amplifiers provides a true high-impedance differential input capability using a patented input protection architecture that does not introduce additional signal distortion or delayed settling time, making the device an optimal op amp for multichannel, high-switched, input applications. The TLV916x-Q1 tolerates a maximum differential swing (voltage between inverting and non-inverting pins of the op amp) of up to 16V, making the device suitable for use as a comparator or in applications with fast-ramping input signals such as data-acquisition systems; see the TI TechNote MUX-Friendly Precision Operational Amplifiers for more information.