SBOSAJ4
June 2024
TLV9304-Q1
PRODMIX
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information for Quad Channel
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Input Protection Circuitry
6.3.2
EMI Rejection
6.3.3
Phase Reversal Protection
6.3.4
Thermal Protection
6.3.5
Capacitive Load and Stability
6.3.6
Common-Mode Voltage Range
6.3.7
Electrical Overstress
6.3.8
Overload Recovery
6.3.9
Typical Specifications and Distributions
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Applications
7.2.1
High Voltage Precision Comparator
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curve
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.1.1.1
TINA-TI (Free Software Download)
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PW|14
MPDS360
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbosaj4_oa
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC specification JS-002
(2)
±1000
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.