SBOS941D February   2019  – August 2021 TLV9301 , TLV9302 , TLV9304

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Phase Reversal Protection
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 Common-Mode Voltage Range
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
      9. 7.3.9 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High Voltage Precision Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (February 2021) to Revision D (August 2021)

  • Removed preview note and added thermal data for VSSOP-8 (DGK) package in Thermal Information for Dual Channel.Go

Changes from Revision B (March 2020) to Revision C (February 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed preview notation from TLV9302 SOT-23 (8) package from Device Information tableGo
  • Removed preview notation from TLV9302 VSSOP (8) package from Device Information tableGo
  • Removed Table of Graphs table from the Specifications sectionGo
  • Removed Related Links section from the Device and Documentation Support sectionGo

Changes from Revision A (April 2019) to Revision B (March 2020)

  • Changed the TLV9301 and TLV9304 device statuses from Advance Information to Production Data Go
  • Removed preview notation from TLV9301 SOT-23 (5) package from Device Information tableGo
  • Removed preview notation from TLV9301 SC70 (5) package from Device Information tableGo
  • Removed preview notation from TLV9304 SOIC (14) package from Device Information tableGo
  • Removed preview notation from TLV9304 TSSOP (14) package from Device Information tableGo
  • Removed preview notation from TLV9301 DBV package (SOT-23) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9301 DCK package (SC70) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from TLV9304 D (SOIC) and TSSOP (PW) packages in the Pin Configuration and Functions sectionGo

Changes from Revision * (February 2019) to Revision A (April 2019)

  • Changed the TLV9302 device status from Advance Information to Production Data Go
  • Removed preview notation from TLV9302 SOIC (8) package from Device Information tableGo