SBOS994E November 2019 – January 2022 TLV9351 , TLV9352 , TLV9354
PRODUCTION DATA
THERMAL METRIC (1) | TLV9354 | UNIT | |||
---|---|---|---|---|---|
D (SOIC) |
DYY (SOT-23) |
PW (TSSOP) |
|||
14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 101.2 | 110.6 | 131.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 57.8 | 53.7 | 52.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 57.2 | 35.3 | 75.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 18.6 | 2.2 | 8.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 56.5 | 35.0 | 74.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |