The TLV936x family (TLV9361, TLV9362, and TLV9364) is a family of 40-V cost-optimized operational amplifiers.
These devices offer strong DC and AC specifications, including rail-to-rail output, low offset (±400 µV, typ), low offset drift (±1.25 µV/°C, typ), and 10.6-MHz bandwidth.
Features such as EMIRR filtering, high output current (±60 mA), and high slew rate (25 V/µs) make the TLV936x a robust operational amplifier for high-voltage, cost-sensitive applications.
The TLV936x family of op amps is available in standard packages and is specified from –40°C to 125°C.
PART NUMBER(1) | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TLV9361 | SOT-23 (5) | 2.90 mm × 1.60 mm |
SC70 (5) | 2.00 mm × 1.25 mm | |
TLV9362 | SOIC (8) | 4.90 mm × 3.90 mm |
SOT-23 (8) | 2.90 mm × 1.60 mm | |
TSSOP (8) | 3.00 mm × 4.40 mm | |
VSSOP (8) | 3.00 mm × 3.00 mm | |
TLV9364 | SOIC (14) | 8.65 mm × 3.90 mm |
TSSOP (14) | 5.00 mm × 4.40 mm |
Changes from Revision A (December 2021) to Revision B (March 2022)
Changes from Revision * (November 2021) to Revision A (December 2021)
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | SOT-23 | SC70 | ||
IN+ | 3 | 1 | I | Noninverting input |
IN– | 4 | 3 | I | Inverting input |
OUT | 1 | 4 | O | Output |
V+ | 5 | 5 | — | Positive (highest) power supply |
V– | 2 | 2 | — | Negative (lowest) power supply |
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
IN1+ | 3 | I | Noninverting input, channel 1 |
IN1– | 2 | I | Inverting input, channel 1 |
IN2+ | 5 | I | Noninverting input, channel 2 |
IN2– | 6 | I | Inverting input, channel 2 |
OUT1 | 1 | O | Output, channel 1 |
OUT2 | 7 | O | Output, channel 2 |
V+ | 8 | — | Positive (highest) power supply |
V– | 4 | — | Negative (lowest) power supply |
PIN | I/O | DESCRIPTION | |||
---|---|---|---|---|---|
NAME | NO. | ||||
IN1+ | 3 | I | Noninverting input, channel 1 | ||
IN1– | 2 | I | Inverting input, channel 1 | ||
IN2+ | 5 | I | Noninverting input, channel 2 | ||
IN2– | 6 | I | Inverting input, channel 2 | ||
IN3+ | 10 | I | Noninverting input, channel 3 | ||
IN3– | 9 | I | Inverting input, channel 3 | ||
IN4+ | 12 | I | Noninverting input, channel 4 | ||
IN4– | 13 | I | Inverting input, channel 4 | ||
OUT1 | 1 | O | Output, channel 1 | ||
OUT2 | 7 | O | Output, channel 2 | ||
OUT3 | 8 | O | Output, channel 3 | ||
OUT4 | 14 | O | Output, channel 4 | ||
V+ | 4 | — | Positive (highest) power supply | ||
V– | 11 | — | Negative (lowest) power supply |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage, VS = (V+) – (V–) | 0 | 42 | V | |
Signal input pins | Common-mode voltage(3) | (V–) – 0.5 | (V+) + 0.5 | V |
Differential voltage(3) | VS + 0.2 | V | ||
Current(3) | –10 | 10 | mA | |
Output short-circuit(2) | Continuous | |||
Operating ambient temperature, TA | –55 | 150 | °C | |
Junction temperature, TJ | 150 | °C | ||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2500 | V | |
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) | ±1500 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VS | Supply voltage, (V+) – (V–) | 4.5 | 40 | V |
VI | Common mode voltage range | (V–) | (V+) – 2 | V |
TA | Specified temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TLV9361, TLV9361S | UNIT | ||
---|---|---|---|---|
DBV (SOT-23) |
DCK (SC70) |
|||
5 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 185.4 | 198.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 83.9 | 94.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 52.5 | 45.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 25.4 | 16.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 52.1 | 45.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |
THERMAL METRIC(1) | TLV9362 | Unit | ||||
---|---|---|---|---|---|---|
D (SOIC) |
DDF (SOT-23) |
DGK (VSSOP) |
PW (TSSOP) |
|||
8 PINS | 8 PINS | 8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 131.0 | 149.6 | 174.2 | 183.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 73.0 | 85.3 | 65.9 | 72.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 74.5 | 68.6 | 95.9 | 114.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 25.0 | 7.9 | 11.0 | 12.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 73.8 | 68.4 | 94.4 | 112.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | °C/W |