SBOSA67B
November 2021 – March 2022
TLV9361
,
TLV9362
,
TLV9364
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information for Single Channel
6.5
Thermal Information for Dual Channel
6.6
Thermal Information for Quad Channel
6.7
Electrical Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
EMI Rejection
7.3.2
Thermal Protection
7.3.3
Capacitive Load and Stability
7.3.4
Electrical Overstress
7.3.5
Overload Recovery
7.3.6
Typical Specifications and Distributions
7.4
Device Functional Modes
8
Application Information Disclaimer
8.1
Application Information
8.2
Typical Applications
8.2.1
Unity-Gain Buffer With RISO Stability Compensation
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
TINA-TI (Free Software Download)
11.1.1.2
TI Precision Designs
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
PW|8
MPDS568
DGK|8
MPDS028E
DDF|8
MPDS569D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbosa67b_oa
sbosa67b_pm
11.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.