SLVSFT6B May   2021  – January 2022 TLVM13630

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Characteristics
    7. 6.7  Typical Characteristics
    8. 6.8  Typical Characteristics: VIN = 12 V
    9. 6.9  Typical Characteristics: VIN = 24 V
    10. 6.10 Typical Characteristics: VIN = 36 V
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Adjustable Output Voltage (FB)
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Output ON/OFF Enable (EN) and VIN UVLO
      7. 7.3.7  Power Good Monitor (PG)
      8. 7.3.8  Internal LDO, VCC Output, and VLDOIN Input
      9. 7.3.9  Overcurrent Protection (OCP)
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: 3-A Synchronous Buck Regulator for Industrial Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Voltage Setpoint
          3. 8.2.1.2.3 Switching Frequency Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Output Capacitor Selection
          6. 8.2.1.2.6 Other Connections
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2: Inverting Buck-Boost Regulator with a –5-V Output
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Setpoint
          2. 8.2.2.2.2 IBB Maximum Output Current
          3. 8.2.2.2.3 Switching Frequency Selection
          4. 8.2.2.2.4 Input Capacitor Selection
          5. 8.2.2.2.5 Output Capacitor Selection
          6. 8.2.2.2.6 Other Connections
        3. 8.2.2.3 Application Curves
          1. 8.2.2.3.1 EMI
            1. 8.2.2.3.1.1 EMI Plots
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Package Specifications
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Other Connections

Place a 1-µF capacitor between the VCC pin and PGND, located near to the device.

The right-half-plane zero of an IBB topology is at its lowest frequency at minimum input voltage. However, it does not appear at low frequency for a –5 V output and thus has minimal effect on the loop response for this application.

In the inverting buck-boost configuration, the input capacitor CIN and output capacitor COUT can formed an AC capacitive divider during a fast VIN transient or hot-plugged event at the input. This event will resulted in a positive voltage spike at the output that may disturb the load. In this case, an optional Schottky diode may be installed between –VOUT and GND as shown in Figure 8-12 to clamp the output spike.