SLVSFT6B May   2021  – January 2022 TLVM13630

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Characteristics
    7. 6.7  Typical Characteristics
    8. 6.8  Typical Characteristics: VIN = 12 V
    9. 6.9  Typical Characteristics: VIN = 24 V
    10. 6.10 Typical Characteristics: VIN = 36 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Adjustable Output Voltage (FB)
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Output ON/OFF Enable (EN) and VIN UVLO
      7. 7.3.7  Power Good Monitor (PG)
      8. 7.3.8  Internal LDO, VCC Output, and VLDOIN Input
      9. 7.3.9  Overcurrent Protection (OCP)
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: 3-A Synchronous Buck Regulator for Industrial Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Voltage Setpoint
          3. 8.2.1.2.3 Switching Frequency Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Output Capacitor Selection
          6. 8.2.1.2.6 Other Connections
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2: Inverting Buck-Boost Regulator with a –5-V Output
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Setpoint
          2. 8.2.2.2.2 IBB Maximum Output Current
          3. 8.2.2.2.3 Switching Frequency Selection
          4. 8.2.2.2.4 Input Capacitor Selection
          5. 8.2.2.2.5 Output Capacitor Selection
          6. 8.2.2.2.6 Other Connections
        3. 8.2.2.3 Application Curves
          1. 8.2.2.3.1 EMI
            1. 8.2.2.3.1.1 EMI Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Package Specifications
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TLVM13630 UNIT
RDH (QFN)
30 PINS
RθJA Junction-to-ambient thermal resistance (TPSM63603 EVM) 29.1 °C/W
RθJA Junction-to-ambient thermal resistance(2) 33.5 °C/W
ψJT Junction-to-top characterization parameter(3) 4.1 °C/W
ψJB Junction-to-board characterization parameter(4) 21.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 64-mm x 83-mm four-layer PCB with 2 oz. copper and natural convection cooling. Additional airflow and PCB copper area reduces RθJA. For more information see the Layout section.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.