SNVSCI2B February   2023  – February 2024 TLVM23615 , TLVM23625

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Output Voltage Selection
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Enable, Start-Up, and Shutdown
      6. 7.3.6  Switching Frequency (RT)
      7. 7.3.7  Power-Good Output Operation
      8. 7.3.8  Internal LDO, VCC and VOUT/FB Input
      9. 7.3.9  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      10. 7.3.10 Soft Start and Recovery from Dropout
        1. 7.3.10.1 Recovery from Dropout
      11. 7.3.11 Overcurrent Protection (Hiccup Mode)
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 Auto Mode – Light-Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode – Light-Load Operation
        4. 7.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Input Capacitor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  VCC
        7. 8.2.2.7  CFF Selection
        8. 8.2.2.8  Power-Good Signal
        9. 8.2.2.9  Maximum Ambient Temperature
        10. 8.2.2.10 Other Connections
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
      3. 9.1.3 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.3 Application Curves

GUID-20240124-SS0I-MRWN-SMM9-WQF1WRNXLVZ0-low.svgFigure 8-3 12VIN Efficiency (Log)
GUID-3F48EC87-076A-43E3-8811-0C679DFC1182-low.svgFigure 8-5 12VIN: Max Ambient Temperature vs Load Current (Analysis on TLVM23625EVM)
GUID-20240124-SS0I-R1RQ-07LG-PH68MLDVL9B4-low.svgFigure 8-7 24VIN Efficiency (Linear)
GUID-20240124-SS0I-09NX-R6TV-QLBTBVXBXL6V-low.svgFigure 8-9 36VIN Efficiency (Log)
GUID-20230206-SS0I-WJGM-4Q8L-MSJGC6VKWWTB-low.svgFigure 8-11 36VIN: Maximum Ambient Temperature vs Load Current (Analysis on TLVM23625EVM)
GUID-2DB6CB4B-A06B-4FE7-935F-2574FF2D8C70-low.png
VIN = 24 VVOUT = 5 V1 MHz (FPWM)
1.25 A to 2.5 A,1 A/µs

COUT = 2 × 22 uF (1210,16VDC)

Figure 8-13 Load Transient
GUID-980C1796-D05E-4171-8F3A-D1FF28D71972-low.svg
VIN = 12 VVOUT = 3.3 V 2 A, 1 MHz
Figure 8-15 EVM Thermal Performance
GUID-1B0BCDA5-7749-47F6-9C72-6522A80FBAEA-low.svg
VIN = 24 VVOUT = 3.3 V 2 A, 500 kHz
Figure 8-17 EVM Thermal Performance
GUID-0673D9A3-C404-4F30-A3D2-C122921ACC72-low.svg
VIN = 24 VVOUT = 3.3 V 2 A, 2.2 MHz
Figure 8-19 EVM Thermal Performance
GUID-16401202-CF51-48AD-AEF0-CFC860C7A026-low.svg
VIN = 24 VVOUT = 5 V Fsw = 1 MHz
Board = TLVM23625EVM (No Filter)Load = 2.5 A
Figure 8-21 CISPR 11 RE, 3-Meter, Scan 30 MHz–1 GHz
GUID-20240124-SS0I-PJDV-ZVDN-BV5DP0GPHTJL-low.svgFigure 8-4 12VIN Efficiency (Linear)
GUID-20240124-SS0I-DPNP-C29G-K8MFF6NWXGWK-low.svgFigure 8-6 24VIN Efficiency (Log)
GUID-20230206-SS0I-LJMN-6BD1-3X2WTW1GCKGR-low.svgFigure 8-8 24VIN: Max Ambient Temperature vs Load Current (Analysis on TLVM23625EVM)
GUID-20240124-SS0I-VGLF-987D-QXQWTBPW9HLW-low.svgFigure 8-10 36VIN Efficiency (Linear)
GUID-D2CA0936-4D82-4596-9ECE-1B7F52795D63-low.png
VIN = 24 VVOUT = 5 V1 MHz (FPWM)
0 A to 2.5 A,1 A/µsCOUT = 2 × 22 uF (1210,16VDC)
Figure 8-12 Load Transient
GUID-1F12A5C7-C2AB-44D8-A771-FD61F5DDDBE4-low.svg
VIN = 12 VVOUT = 3.3 V 2 A, 500 kHz
Figure 8-14 EVM Thermal Performance
GUID-322E9F37-56B0-4E8F-A392-8A1D96E2F930-low.svg
VIN = 12 VVOUT = 3.3 V 2 A, 2.2 MHz
Figure 8-16 EVM Thermal Performance
GUID-04915BFA-7DB5-4206-93EC-351F0C98DA68-low.svg
VIN = 24 VVOUT = 3.3 V 2 A, 1 MHz
Figure 8-18 EVM Thermal Performance
GUID-25293631-8771-4E2E-B7A5-57DC0AD40238-low.svg
VIN = 24 VVOUT = 5 V Fsw = 1 MHz
Board = TLVM23625EVMLoad = 2.5 A
Figure 8-20 CISPR 11, Class B, CE Scan 150 kHz–30 MHz