SNVSCI2B February   2023  – February 2024 TLVM23615 , TLVM23625

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Output Voltage Selection
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Enable, Start-Up, and Shutdown
      6. 7.3.6  Switching Frequency (RT)
      7. 7.3.7  Power-Good Output Operation
      8. 7.3.8  Internal LDO, VCC and VOUT/FB Input
      9. 7.3.9  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      10. 7.3.10 Soft Start and Recovery from Dropout
        1. 7.3.10.1 Recovery from Dropout
      11. 7.3.11 Overcurrent Protection (Hiccup Mode)
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 Auto Mode – Light-Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode – Light-Load Operation
        4. 7.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Input Capacitor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  VCC
        7. 8.2.2.7  CFF Selection
        8. 8.2.2.8  Power-Good Signal
        9. 8.2.2.9  Maximum Ambient Temperature
        10. 8.2.2.10 Other Connections
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
      3. 9.1.3 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 System Characteristics

The following specifications apply only to the typical applications circuit, with nominal component values. Specifications in the typical (TYP) column apply to TJ = 25°C only. These specifications are not ensured by production testing.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
IIN Input supply current when in regulation VIN = 24 V, VOUT = 3.3 V(RFBT = 23.2 kΩ), VEN = VIN, FSW = 1000 kHz, IOUT = 0 A,PFM 6.9 μA
IIN Input supply current when in regulation VIN = 24 V, VOUT = 5 V(RFBT = 40.2 kΩ), VEN = VIN, FSW = 1000 kHz, IOUT = 0 A,PFM 7 μA
OUTPUT VOLTAGE
VFB Load regulation VOUT = 3.3 V, VIN = 24 V, IOUT = 0.4 A to full load(FPWM)
3
 		 mV
VFB Line regulation VOUT = 3.3 V, VIN = 4 V to 36 V, IOUT = 2.5 A
10
 		 mV
VOUT Load transient VOUT = 3.3 V, VIN = 24 V, IOUT = 1 A to 2.5 A @ 2 A/μs,  COUT(derated) = 32 uF
100		 mV
EFFICIENCY
η Efficiency VOUT = 3.3 V, VIN = 12 V, IOUT = 2.5 A,  FSW = 1 MHz 84
 
%
VOUT = 3.3 V, VIN = 24 V, IOUT = 2.5 A,  FSW = 1 MHz 83
%
VOUT = 5 V, VIN = 24 V, IOUT = 2.5 A,  FSW = 1 MHz 87
%
VOUT = 5 V, VIN = 36 V, IOUT = 2.5 A,  FSW = 1 MHz 86
 
%
Thermal Shutdown
TSDN Thermal shutdown threshold Temperature rising 158 168 186 °C
THYST Thermal shutdown hysteresis 15 20 °C