For related documentation see the following:
- For TI's WEBENCH Power
Designer environment, visit the WEBENCH design
center
- Texas Instruments, Thermal Design by Insight not
Hindsight application report
- Texas Instruments, A Guide to Board Layout for
Best Thermal Resistance for Exposed Pad
Packages application report
- Texas Instruments, Semiconductor and IC Package
Thermal Metrics application report
- Texas Instruments, Thermal Design Made Simple
with LM43603 and LM43602 application
report
- Texas Instruments, PowerPAD™ Thermally Enhanced Package
application report
- Texas Instruments, PowerPAD™ Made Easy
application report
- Texas Instruments, Using New Thermal Metrics
application report
- Texas Instruments, Layout Guidelines for
Switching Power Supplies application
report
- Texas Instruments, Simple Switcher PCB Layout
Guidelines application report
- Texas Instruments, Construction Your Power Supply- Layout Considerations Seminar
- Texas Instruments, Low Radiated EMI Layout Made
Simple with LM4360x and LM4600x application
report
- Texas Instruments, Optimizing Transient Response
of Internally Compensated DC-DC Converters with
Feed forward Capacitor application
report