THERMAL METRIC(1) |
TLVM365R15 / TLVM365R1 |
UNIT |
RDN |
11 PINS |
RθJA |
Junction-to-ambient thermal resistance (2) |
42.9 |
°C/W |
ψJT |
Junction-to-top characterization parameter (3) |
4.4 |
°C/W |
ψJB |
Junction-to-board characterization parameter (4) |
17.2 |
°C/W |
(2) The value of RθJA given in this table is valid for comparison with other packages and can not be used for design purposes. This value was calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. It does not represent the performance obtained in an actual application.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT ∙ Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJB ∙ Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1-mm from the device.