SLYS053B November   2023  – June 2024 TMAG3001

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Temperature Sensor
    7. 5.7  Magnetic Characteristics For A1
    8. 5.8  Magnetic Characteristics For A2
    9. 5.9  Magnetic Temp Compensation Characteristics
    10. 5.10 I2C Interface Timing
    11. 5.11 Power up Timing
    12. 5.12 Timing Diagram
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Interrupt Function
      4. 6.3.4 Wake on Change
      5. 6.3.5 Device I2C Address
      6. 6.3.6 Magnetic Range Selection
      7. 6.3.7 Update Rate Settings
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby (Trigger) Mode
      2. 6.4.2 Sleep Mode
      3. 6.4.3 Wake-Up and Sleep (W&S) Mode
      4. 6.4.4 Continuous Measure Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 Conversion Trigger
        2. 6.5.1.2 Bus Transactions
          1. 6.5.1.2.1 Three Channels I2C Write
          2. 6.5.1.2.2 General Call Write
          3. 6.5.1.2.3 Standard I2C Read
          4. 6.5.1.2.4 I2C Read Command for 16-bit Data
          5. 6.5.1.2.5 I2C Read Command for 8-Bit Data
          6. 6.5.1.2.6 I2C Read CRC
      2. 6.5.2 Data Definition
        1. 6.5.2.1 Magnetic Sensor Data
        2. 6.5.2.2 Temperature Sensor Data
        3. 6.5.2.3 Magnetic Sensor Gain Correction
        4. 6.5.2.4 Magnetic Sensor Offset Correction
        5. 6.5.2.5 Angle and Magnitude Data Definition
        6. 6.5.2.6 Angle Offset Correction
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Select the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Magnetic Limit Check
      5. 7.1.5 Magnitude Limit Check
      6. 7.1.6 Angle Limit Check
      7. 7.1.7 Switch Mode
        1. 7.1.7.1 Unipolar Switch Mode
        2. 7.1.7.2 Omnipolar Switch Mode
        3. 7.1.7.3 Tamper Detection
        4. 7.1.7.4 Angle Switch
        5. 7.1.7.5 Magnitude Switch (Button Press Detection)
      8. 7.1.8 Error Calculation During Linear Measurement
      9. 7.1.9 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Angle Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Gain Adjustment for Angle Measurement
        3. 7.2.1.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Map
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TMAG3001 UNIT
YBG (WCSP)
6 PINS
RθJA Junction-to-ambient thermal resistance 131.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.4 °C/W
RθJC(bottom) Junction-to-case (top) thermal resistance N/A °C/W
RθJB Junction-to-board thermal resistance 36.4 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 36.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.