SLYS029C July   2021  – December 2024 TMAG5110-Q1 , TMAG5111-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 2D Description
        1. 7.3.1.1 2D General Description and Advantages
        2. 7.3.1.2 2D Magnetic Sensor Response
        3. 7.3.1.3 Axis Polarities
      2. 7.3.2 Axis Options
        1. 7.3.2.1 Device Placed In-Plane to Magnet
        2. 7.3.2.2 Device Placed on the Side Edge of the Magnet
      3. 7.3.3 Power-On Time
      4. 7.3.4 Propagation Delay
      5. 7.3.5 Hall Element Location
      6. 7.3.6 Power Derating
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Incremental Rotary Encoding Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Power-On Time

Figure 7-17 shows the behavior of the device after the VCC voltage is applied and when the field is below the BOP threshold. When the minimum value for VCC is reached, the TMAG5110-Q1 takes time tON to power up and then time tPD to update the output to a level High.

Figure 7-18 shows the behavior of the device after the VCC voltage is applied and when the field is above the BOP threshold. When the minimum value for VCC is reached, the TMAG5110-Q1 takes time tON to power up and then time tPD to update the output to a level High.

For the TMAG5111-Q1, the power-on behavior is similar, but OUT1 updates to Low during the tPD time. OUT2 updates to High during the tPD time. The output value following the power-on sequence then depends on the magnet placement, the sense of rotation, and the device variant.

TMAG5110-Q1 TMAG5111-Q1 Power-On Time When B<BOP Figure 7-17 Power-On Time When B<BOP
TMAG5110-Q1 TMAG5111-Q1 Power-On Time When B>BOP Figure 7-18 Power-On Time When B>BOP

TMAG5110-Q1 devices with the R pinout version have a Low output state during the tPD time. The output stays Low if the field sensed at power-on is between BOP and BRP, until BRP is crossed. This behavior for the TMAG5110-Q1 R pinout versions can be seen in Figure 7-19 and Figure 7-20.

TMAG5110-Q1 TMAG5111-Q1 Power-On Time When B<BOP (R Pinout Version) Figure 7-19 Power-On Time When B<BOP (R Pinout Version)
TMAG5110-Q1 TMAG5111-Q1 Power-On Time When B>BOP (R Pinout Version) Figure 7-20 Power-On Time When B>BOP (R Pinout Version)