SLYS029C July   2021  – December 2024 TMAG5110-Q1 , TMAG5111-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 2D Description
        1. 7.3.1.1 2D General Description and Advantages
        2. 7.3.1.2 2D Magnetic Sensor Response
        3. 7.3.1.3 Axis Polarities
      2. 7.3.2 Axis Options
        1. 7.3.2.1 Device Placed In-Plane to Magnet
        2. 7.3.2.2 Device Placed on the Side Edge of the Magnet
      3. 7.3.3 Power-On Time
      4. 7.3.4 Propagation Delay
      5. 7.3.5 Hall Element Location
      6. 7.3.6 Power Derating
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Incremental Rotary Encoding Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.5 Hall Element Location

The sensing element inside the device is in the center when viewed from the top. Figure 7-23 shows the exact position of the sensors in regard of the package.

TMAG5110-Q1 TMAG5111-Q1 Hall Element Location Figure 7-23 Hall Element Location