SLYS029C July   2021  – December 2024 TMAG5110-Q1 , TMAG5111-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 2D Description
        1. 7.3.1.1 2D General Description and Advantages
        2. 7.3.1.2 2D Magnetic Sensor Response
        3. 7.3.1.3 Axis Polarities
      2. 7.3.2 Axis Options
        1. 7.3.2.1 Device Placed In-Plane to Magnet
        2. 7.3.2.2 Device Placed on the Side Edge of the Magnet
      3. 7.3.3 Power-On Time
      4. 7.3.4 Propagation Delay
      5. 7.3.5 Hall Element Location
      6. 7.3.6 Power Derating
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Incremental Rotary Encoding Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.6 Power Derating

The device is specified from –40°C to 125°C for a voltage rating of 2.5 V to 38 V. Because the part is draining at its maximum a current of 17 mA the maximum voltage that can be applied will depend on what is the maximum ambient temperature acceptable for the application. The curve in Figure 7-24 shows the maximum acceptable power supply voltage versus the maximum acceptable ambient temperature.

The Figure 7-24 can also be calculated using the following formulas:

Equation 1. TMAG5110-Q1 TMAG5111-Q1

where

  • TJ is the junction temperature
  • TA is the ambient temperature
  • ΔT is the difference between the junction temperature and the ambient temperature
Equation 2. TMAG5110-Q1 TMAG5111-Q1

where

  • PD is the power dissipated by the part
  • RθJA is the junction to ambient thermal resistance
Equation 3. TMAG5110-Q1 TMAG5111-Q1

where

  • VCC is the voltage supply of the device
  • ICC is the current consumption of the device

Combining the three equations above gives Equation 4 below:

Equation 4. TMAG5110-Q1 TMAG5111-Q1

This equation gives the maximum voltage the part can handle in regards of the ambient temperature.

For example, with an the application required to work within a ambient temperature of maximum 85°C, and TJmax, RθJA and ICCmax are defined in the data sheet, the maximum voltage allowed for this application is determined in Equation :

TMAG5110-Q1 TMAG5111-Q1
TMAG5110-Q1 TMAG5111-Q1 Power Derating CurveFigure 7-24 Power Derating Curve