SLYS029B July   2021  – June 2022 TMAG5110-Q1 , TMAG5111-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 2D Description
        1. 8.3.1.1 2D General Description and Advantages
        2. 8.3.1.2 2D Magnetic Sensor Response
        3. 8.3.1.3 Axis Polarities
      2. 8.3.2 Axis Options
        1. 8.3.2.1 Device Placed In-Plane to Magnet
        2. 8.3.2.2 Device Placed on the Side Edge of the Magnet
      3. 8.3.3 Power-On Time
      4. 8.3.4 Propagation Delay
      5. 8.3.5 Hall Element Location
      6. 8.3.6 Power Derating
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Incremental Rotary Encoding Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power Supply Voltage VCC –20 40 V
Voltage ramp rate (VCC < 5V) Unlimited V/µs
Voltage ramp rate (VCC > 5V) 0 2
Output Pin Voltage VOUT1, VOUT2 GND – 0.5 40 V
Output pin reverse current during reverse supply condition 0 100 mA
Magnetic flux density,BMAX Unlimited T
Junction temperature, TJ Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.