SBASAJ1B
December 2022 – August 2024
TMAG5115
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Magnetic Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Field Direction Definition
7.3.2
Device Output
7.3.3
Power-On Time
7.3.4
Output Stage
7.3.5
Protection Circuits
7.3.5.1
Short-Circuit Protection
7.3.5.2
Overtemperature Protection
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Standard Circuit
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Configuration Example
8.2.1.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Hall Sensor Location
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DBZ|3
MPDS108G
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbasaj1b_oa
sbasaj1b_pm
6.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
CC
Power supply voltage
(1)
2.5
26
V
V
O
Output pin voltage
0
26
V
I
SINK
Output pin current sink
0
15
mA
T
A
Ambient temperature
–40
125
°C
(1)
Operating outside the
TMAG5115 Recommended Supply and Temperature Curve
can cause the device to enter a thermal shutdown state.