SLYS033 November   2021 TMAG5124-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 TMAG5124A and TMAG5124E
      2. 7.7.2 TMAG5124B and TMAG5124F
      3. 7.7.3 TMAG5124C and TMAG5124G
      4. 7.7.4 TMAG5124D and TMAG5124H
      5. 7.7.5 Current Output Level
        1. 7.7.5.1 Low-Level Current Output for TMAG5124A/B/C/D
        2. 7.7.5.2 Low-Level Current Output for TMAG5124E/F/G/H
        3. 7.7.5.3 High-Level Current Output for Every Version
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Field Direction Definition
      2. 8.3.2 Device Output
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Load Dump Protection
        2. 8.3.3.2 Reverse Polarity Protection
      4. 8.3.4 Power-On Time
      5. 8.3.5 Hall Element Location
      6. 8.3.6 Propagation Delay
      7. 8.3.7 Chopper Stabilization
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side and Low-Side Typical Application Diagrams
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  11. 10Power Supply Recommendations
    1. 10.1 Power Derating
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.4 Power-On Time

Figure 8-4 shows the behavior of the device after the VCC voltage is applied and when the field is below the BOP threshold. When the minimum value for VCC is reached, the TMAG5124-Q1 will take time tON to power up and then time td to update the output to a high level.

Figure 8-5 shows the behavior of the device after the VCC voltage is applied and when the field is above the BOP threshold. When the minimum value for VCC is reached, the TMAG5124-Q1 will take time tON to power up and then time td to update the output to a high level.

The output value during tON is unknown in both cases. The output value during td will be set at high.

GUID-20201005-CA0I-MGXZ-T13S-VR0CLSCTKFNC-low.gif Figure 8-4 Power-On Time When B < BOP
GUID-20201005-CA0I-XCCT-LGGX-TJMDZRPSQWX6-low.gif Figure 8-5 Power-On Time When B > BOP