SLYS033 November   2021 TMAG5124-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 TMAG5124A and TMAG5124E
      2. 7.7.2 TMAG5124B and TMAG5124F
      3. 7.7.3 TMAG5124C and TMAG5124G
      4. 7.7.4 TMAG5124D and TMAG5124H
      5. 7.7.5 Current Output Level
        1. 7.7.5.1 Low-Level Current Output for TMAG5124A/B/C/D
        2. 7.7.5.2 Low-Level Current Output for TMAG5124E/F/G/H
        3. 7.7.5.3 High-Level Current Output for Every Version
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Field Direction Definition
      2. 8.3.2 Device Output
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Load Dump Protection
        2. 8.3.3.2 Reverse Polarity Protection
      4. 8.3.4 Power-On Time
      5. 8.3.5 Hall Element Location
      6. 8.3.6 Propagation Delay
      7. 8.3.7 Chopper Stabilization
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side and Low-Side Typical Application Diagrams
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  11. 10Power Supply Recommendations
    1. 10.1 Power Derating
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Power Derating

The device is specified from –40°C to 150°C for a voltage rating of 2.7 V to 38 V. The part drains at its maximum current of 17 mA, therefore the maximum voltage that can be applied to the device will depend on what maximum ambient temperature is acceptable for the application. The curve in Figure 10-1 shows the maximum acceptable power supply voltage versus the maximum acceptable ambient temperature.

Use Equation 3, Equation 4, and Equation 5 to populate the data shown in Figure 10-1:

Equation 3. GUID-BDF79CC5-B085-47FB-99FA-AB53C630D876-low.gif

where

  • TJ is the junction temperature.
  • TA is the ambient temperature.
  • ΔT is the difference between the junction temperature and the ambient temperature.
Equation 4. GUID-1238350B-EBF1-4F5F-8028-D11AED928C60-low.gif

where

  • PD is the power dissipated by the part.
  • RθJA is the junction to ambient thermal resistance.
Equation 5. GUID-705B229F-C23F-4ABA-8250-F81992409A88-low.gif

where

  • VCC is the voltage supply of the device.
  • ICC is the current consumption of the device.

Combining these equations gives Equation 6, which can be used to determine the maximum voltage the part can handle in regards of the ambient temperature.

Equation 6. GUID-EB4E6960-6B2E-4C3C-AF6E-EB8577D693AA-low.gif

For example, if an application must work under an ambient temperature maximum of 100°C, and the TJ max, RθJA and ICC max are the same values defined in the data sheet, then the maximum voltage allowed for this application is calculated in Equation 7:

Equation 7. GUID-FB5540AD-CFC8-415A-A49C-A54B91BC7DBD-low.gif
GUID-20200930-CA0I-Z2DM-G6P8-HWJLT32VRHSP-low.gif Figure 10-1 Power Derating Curve