SLYS052A March   2023  – December 2023 TMAG5170D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Power up Timing
    8. 5.8 SPI Interface Timing
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Magnetic Range Selection
      4. 6.3.4 Update Rate Settings
      5. 6.3.5 ALERT Function
        1. 6.3.5.1 Interrupt and Trigger Mode
        2. 6.3.5.2 Magnetic Switch Mode
      6. 6.3.6 Threshold Count
      7. 6.3.7 Diagnostics
        1. 6.3.7.1  Memory Cyclic Redundancy Check (CRC)
        2. 6.3.7.2  ALERT Integrity Check
        3. 6.3.7.3  VCC Check
        4. 6.3.7.4  Internal LDO Undervoltage Check
        5. 6.3.7.5  Digital Core Power-On Reset Check
        6. 6.3.7.6  SDO Output Check
        7. 6.3.7.7  Communication Cyclic Redundancy Check (CRC)
        8. 6.3.7.8  Oscillator Integrity Check
        9. 6.3.7.9  Magnetic Field Threshold Check
        10. 6.3.7.10 Temperature Alert Check
        11. 6.3.7.11 Analog Front-End (AFE) Check
        12. 6.3.7.12 Hall Resistance and Switch Matrix Check
        13. 6.3.7.13 Hall Offset Check
        14. 6.3.7.14 ADC Check
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Configuration Mode (DEFAULT)
        4. 6.4.1.4 Sleep Mode
        5. 6.4.1.5 Wake-Up and Sleep Mode
        6. 6.4.1.6 Deep-Sleep Mode
    5. 6.5 Programming
      1. 6.5.1 Data Definition
        1. 6.5.1.1 Magnetic Sensor Data
        2. 6.5.1.2 Temperature Sensor Data
        3. 6.5.1.3 Magnetic Sensor Offset Correction
        4. 6.5.1.4 Angle and Magnitude Data Definition
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SCK
        2. 6.5.2.2 CS
        3. 6.5.2.3 SDI
        4. 6.5.2.4 SDO
          1. 6.5.2.4.1 Regular 32-Bit SDO Read
          2. 6.5.2.4.2 Special 32-Bit SDO Read
        5. 6.5.2.5 SPI CRC
        6. 6.5.2.6 SPI Frame
          1. 6.5.2.6.1 32-Bit Read Frame
          2. 6.5.2.6.2 32-Bit Write Frame
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Selecting the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Error Calculation During Linear Measurement
      5. 7.1.5 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Gain Adjustment for Angle Measurement
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Map
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions


GUID-20220721-CA0I-GLVL-V0V4-JDC0WJQKRTMV-low.svg
Figure 4-1 PW Package16-Pin TSSOPTop View
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 CS2 I Chip select, bottom die
2 SDO2 O Serial data out, bottom die
3 SCK2 I Serial clock, bottom die
4 SDI2 I Serial data in, bottom die
5 SCK1 I Serial clock, top die
6 SDI1 I Serial data in, top die
7 SDO1 O Serial data out, top die
8 CS1 I Chip select, top die
9 VCC1 P Main power supply, top die. Handles 2.3-V to 5.5-V power supply input
10 GND1 G Ground, top die
11 TEST1 I/O Test input, top die, connect to ground
12 ALERT1 I/O Status output/Trigger, top die
13 TEST2 I/O Test input, bottom die, connect to ground
14 ALERT2 I/O Status output/Trigger, bottom die
15 GND2 G Ground, bottom die
16 VCC2 P Main power supply, bottom die. Handles 2.3-V to 5.5-V power supply input
(1) I = input, O = output, I/O = input and output, G = ground, P = power