SLYS042D August   2021  – September 2022 TMAG5231

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Magnetic Response
      3. 8.3.3 Output Type
      4. 8.3.4 Sampling Rate
      5. 8.3.5 Hall Element Location
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Defining the Design Implementation
    2. 9.2 Typical Applications
      1. 9.2.1 Hinge
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Slide-By
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 Support Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical and Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-4354BC18-A314-424E-B7D8-5574989424CC-low.gifFigure 6-1 DBZ Package3-Pin SOT-23Top View
Figure 6-2 DMR Package4-Pin X2SONTop View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME SOT-23 (3) X2SON (4)
GND 3 1 — Ground reference
OUT 2 3 O Omnipolar output that responds to north and south magnetic poles
VCC 1 4 — 1.65-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value of at least 0.1 µF.
NC — 2 — No connect. This pin is not connected to the silicon. It should be left floating or tied to ground. It should be soldered to the board for mechanical support.
Thermal Pad — PAD — No connect. This pin should be left floating or tied to ground. It should be soldered to the board for mechanical support.