SLYS042D August   2021  – September 2022 TMAG5231

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Magnetic Response
      3. 8.3.3 Output Type
      4. 8.3.4 Sampling Rate
      5. 8.3.5 Hall Element Location
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Defining the Design Implementation
    2. 9.2 Typical Applications
      1. 9.2.1 Hinge
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Slide-By
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 Support Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical and Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision C (June 2022) to Revision D (September 2022)

  • Changed Device Information table to Package Information Go
  • Changed the package information in Device Comparison tableGo
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo

Changes from Revision B (March 2022) to Revision C (June 2022)

  • Changed data sheet status from Production Mixed to Production DataGo
  • Added Additional Magnetic Threshold option to Features sectionGo
  • Added TMAG5231A1C TMAG5231A2D, and TMAG5231C1D to Device Comparison tableGo
  • Added TMAG5231xxC to Electrical Characteristics tableGo
  • Added TMAG5231Axx to the Magnetic Characteristics tableGo

Changes from Revision A (November 2021) to Revision B (March 2022)

  • Changed data sheet status from Production Data to Production MixedGo
  • Added Advanced Information DMR (X2SON) package to the data sheetGo
  • Changed the Device Comparison tableGo

Changes from Revision * (August 2021) to Revision A (November 2021)

  • Changed data sheet status from Advanced Information to Production DataGo
  • Added the FA and FD device versionsGo