SBASAI5B May   2023  – November 2023 TMAG5253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Sensitivity Linearity
    2. 7.2 Ratiometric Architecture
    3. 7.3 Sensitivity Temperature Compensation
    4. 7.4 Quiescent Voltage Temperature Drift
    5. 7.5 Power-On Time
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Hall Element Location
      3. 8.3.3 Magnetic Response
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Selecting the Sensitivity Option
      2. 9.1.2 Temperature Compensation for Magnets
      3. 9.1.3 Adding a Low-Pass Filter
      4. 9.1.4 Designing With Multiple Sensors
      5. 9.1.5 Duty-Cycled, Low-Power Design
    2. 9.2 Typical Applications
      1. 9.2.1 Slide-By Displacement Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On Displacement Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Remote-Sensing Applications
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.5 Duty-Cycled, Low-Power Design

For battery-powered applications where power is critical, the sensor can be duty-cycled using the EN pin. This will ensure the average current consumption remains low to meet the system level power targets. In duty-cycled applications, the start-up time must be very fast so the external ADC can sample the signal faster and shutdown the device quickly to minimize average power. With very fast start-up and power-off times, the TMAG5253 enables low average power consumption for the system.

GUID-20220527-SS0I-0GCD-SVGQ-XGLDTWMS8P9B-low.svg Figure 9-3 Typical Application Diagram for Duty-Cycled Application

Figure 9-3 shows the typical application diagram when the EN pin is controlled by the microcontroller. Figure 9-4 shows the waveforms for this application where the EN pin is duty-cycled. The sampling time of the ADC should be scheduled after the output settles down to the required resolution. Notice that the output line is pulled down by the external resistor when EN is driven low. Also, if the input magnetic field is changed when the part is in shutdown, the device provides the new output corresponding to the field after the device enters active state.

GUID-20220526-SS0I-WFSZ-PKLG-JDD7G7TX9CW2-low.svg Figure 9-4 Timing Diagram for Duty-Cycled Application

Table 9-3 shows the estimated average current consumption for the TMAG5253 versus the sleep time, for VCC = 1.8 V and the EN pin is tied high for 50 µs.

Table 9-1 Average Current Consumption

SLEEP TIME (ms)

 AVERAGE CURRENT (µA)

1

90.5

10

9.4

50

1.9

100

0.9

1000

0.1