SBASAI5B May   2023  – November 2023 TMAG5253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Sensitivity Linearity
    2. 7.2 Ratiometric Architecture
    3. 7.3 Sensitivity Temperature Compensation
    4. 7.4 Quiescent Voltage Temperature Drift
    5. 7.5 Power-On Time
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Hall Element Location
      3. 8.3.3 Magnetic Response
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Selecting the Sensitivity Option
      2. 9.1.2 Temperature Compensation for Magnets
      3. 9.1.3 Adding a Low-Pass Filter
      4. 9.1.4 Designing With Multiple Sensors
      5. 9.1.5 Duty-Cycled, Low-Power Design
    2. 9.2 Typical Applications
      1. 9.2.1 Slide-By Displacement Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On Displacement Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Remote-Sensing Applications
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 Remote-Sensing Applications

For remote-sensing applications where the sensor is not physically placed on the same board as the ADC or the microcontroller, it is important to have the ability to drive a capacitive load from the wiring harness. The TMAG5253 enables remote-sensing applications with the ability to support up to 1-nF capacitive load on the OUT pin. With a typical cable capacitance of about 100 pF/m, the TMAG5253 can support up to 10 m in cable length.

GUID-20220531-SS0I-NCHS-XVZM-DRD500QMDG2Z-low.svg Figure 9-10 Remote-Sensing Application With Wire Break Detection

Some remote-sensing applications might require a device to detect if interconnect wires open or short. The TMAG5253 can support this feature with the ability to drive up to ±1-mA current load on the output. To design for wire break detection, first select a sensitivity option that causes the output voltage to stay within the VL range during normal operation. Second, add a pullup resistor between OUT and VCC. TI recommends a value between 20 kΩ to 100 kΩ, and the current through OUT must not exceed the IO specification, including current going into an external ADC. Then, if the output voltage is ever measured to be within 100 mV of VCC or GND, a fault condition exists. Figure 9-10 shows the circuit, and Table 9-4 describes fault scenarios.

Table 9-4 Fault Scenarios and the Resulting VOUT
FAULT SCENARIO VOUT
VCC disconnects Close to GND
GND disconnects Close to VCC
VCC shorts to OUT Close to VCC
GND shorts to OUT Close to GND