SLYS045B June   2021  – July 2024 TMAG5273

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Temperature Sensor
    7. 5.7  Magnetic Characteristics For A1, B1, C1, D1
    8. 5.8  Magnetic Characteristics For A2, B2, C2, D2
    9. 5.9  Magnetic Temp Compensation Characteristics
    10. 5.10 I2C Interface Timing
    11. 5.11 Power up & Conversion Time
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Interrupt Function
      4. 6.3.4 Device I2C Address
      5. 6.3.5 Magnetic Range Selection
      6. 6.3.6 Update Rate Settings
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby (Trigger) Mode
      2. 6.4.2 Sleep Mode
      3. 6.4.3 Wake-up and Sleep (W&S) Mode
      4. 6.4.4 Continuous Measure Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 SCL
        2. 6.5.1.2 SDA
        3. 6.5.1.3 I2C Read/Write
          1. 6.5.1.3.1 Standard I2C Write
          2. 6.5.1.3.2 General Call Write
          3. 6.5.1.3.3 Standard 3-Byte I2C Read
          4. 6.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
          5. 6.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
          6. 6.5.1.3.6 I2C Read CRC
      2. 6.5.2 Data Definition
        1. 6.5.2.1 Magnetic Sensor Data
        2. 6.5.2.2 Temperature Sensor Data
        3. 6.5.2.3 Angle and Magnitude Data Definition
        4. 6.5.2.4 Magnetic Sensor Offset Correction
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Select the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Magnetic Limit Check
      5. 7.1.5 Error Calculation During Linear Measurement
      6. 7.1.6 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Magnetic Tamper Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 I2C Address Expansion
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Angle Measurement
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
          1. 7.2.3.2.1 Gain Adjustment for Angle Measurement
        3. 7.2.3.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Maps
    1. 8.1 TMAG5273 Registers
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.11 Power up & Conversion Time

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tstart_power_up Time to go to standby mode after VCC supply voltage crossing VCC_MIN 270 µs
tstart_sleep Time to go from sleep mode to standby mode(1) 50 µs
tstart_measure Time to go from standby mode to continuous measure mode 70 µs
tmeasure Conversion time
Only one channel enabled
OPERATING_MODE = 10b		 CONV_AVG = 000b(2) 50 µs
CONV_AVG = 101b(3) 825 µs
tgo_sleep Time to go into sleep mode after SCL goes high 20 µs
(1) The device only recognizes the I2C communication from a primary during standby or continuous measure modes. While the device is in sleep mode, a valid secondary address wakes up the device but no acknowledge is sent to the primary. Consider the start-up time before addressing the device after wake up.
(2) Add 25µs for each additional magnetic channel enabled for conversion with CONV_AVG = 000b. When CONV_AVG = 000b, the conversion time doesn't change with the T_CH_EN bit setting.
(3)
For conversion with CONV_AVG =101b, each channel data is collected 32 times. If an additional channel is enabled with CONV_AVG =101b, add 32×25µs = 800µs to the tmeasure to calculate the conversion time for two channels.