SLYS037A March   2023  – March 2024 TMAG6180-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensors Location and Placement Tolerances
      3. 6.3.3 Magnetic Response
      4. 6.3.4 Parameters Definition
        1. 6.3.4.1 AMR Output Parameters
        2. 6.3.4.2 Transient Parameters
          1. 6.3.4.2.1 Power-On Time
        3. 6.3.4.3 Angle Accuracy Parameters
        4. 6.3.4.4 Hall Sensor Parameters
      5. 6.3.5 Automatic Gain Control (AGC)
      6. 6.3.6 Safety and Diagnostics
        1. 6.3.6.1 Device Level Checks
        2. 6.3.6.2 System Level Checks
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Fault Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Supply as the Reference for External ADC
      2. 7.1.2 AMR Output Dependence on Airgap Distance
      3. 7.1.3 Calibration of Sensor Errors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Extending the Angle Range to 360 Degrees
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TMAG6180-Q1 UNIT
DGK (VSSOP)
8  PINS
RθJA Junction-to-ambient thermal resistance 166.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 57.8 °C/W
RθJB Junction-to-board thermal resistance 88.7 °C/W
ΨJT Junction-to-top characterization parameter 7.0 °C/W
ΨJB Junction-to-board characterization parameter 87.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.