SBOSA43 June 2021 TMCS1100-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TMCS1100 -Q1 (2) | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 36.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 9.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | –0.1 | °C/W |
ΨJB | Junction-to-board characterization parameter | 11.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |