SBOSAG0B October   2023  – August 2024 TMCS1133

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specifications
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error and Offset Error Drift
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Ambient Field Rejection
      3. 8.3.3 High-Precision Signal Chain
        1. 8.3.3.1 Temperature Stability
        2. 8.3.3.2 Lifetime and Environmental Stability
      4. 8.3.4 Internal Reference Voltage
      5. 8.3.5 Current-Sensing Measurable Ranges
      6. 8.3.6 Overcurrent Detection
      7. 8.3.7 Sensor Diagnostics
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Total Error Calculation Examples
        1. 9.1.1.1 Room-Temperature Error Calculations
        2. 9.1.1.2 Full-Temperature Range Error Calculations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Device Support
      1. 10.2.1 Development Support
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DVG|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

Table 4-1 Device Comparison
PRODUCT(3) SENSITIVITY ZERO CURRENT OUTPUT VOLTAGE IIN LINEAR MEASUREMENT RANGE(1)
VS = 5V VS = 3.3V
TMCS1133A1A 25mV/A 2.5V ±96A(2) –96A to 28A(2)
TMCS1133A2A 50mV/A ±48A(2) –48A to 14A(2)
TMCS1133A3A 75mV/A ±32A –32A to 9.3A
TMCS1133A4A 100mV/A ±24A –24A to 7A
TMCS1133A5A 150mV/A ±16A –16A to 4.7A
TMCS1133B7A 20mV/A 1.65V –77.5A to 163A(2) ±77.5A(2)
TMCS1133B1A 25mV/A –62A to 130A(2) ±62A(2)
TMCS1133B8A 33mV/A –47A to 98.5A(2) ±47A(2)
TMCS1133B2A 50mV/A –31A to 65A(2) ±31A
TMCS1133B3A 75mV/A –20.7A to 43.3A(2) ±20.7A
TMCS1133B4A 100mV/A –15.5A to 32.5A ±15.5A
TMCS1133B5A 150mV/A –10.3A to 21.7A ±10.3A
TMCS1133C1A 25mV/A 0.33V –9.2A to 183A(2) –9.2A to 115A(2)
TMCS1133C2A 50mV/A –4.6A to 91.4A(2) –4.6A to 57.4A(2)
TMCS1133C9A 66mV/A –3.4A to 69.2A(2) –3.4A to 43.4A(2)
TMCS1133C3A 75mV/A –3.1A to 60.9A(2) –3.1A to 38.3A(2)
TMCS1133C4A 100mV/A –2.3A to 45.7A(2) –2.3A to 28.7A
TMCS1133C5A 150mV/A –1.5A to 30.5A –1.5A to 19.1A
(1) Linear range limited by the maximum output swing to power supply (3V to 5.5V) and ground, not by thermal limitations.
(2) Current levels must remain below both allowable continuous DC/RMS and transient peak current safe operating areas to not exceed device thermal limits. See the Safe Operating Area section.
(3) For more information on the device name and device options, see the Device Nomenclature section.