SBOSAG0B October   2023  – August 2024 TMCS1133

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specifications
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error and Offset Error Drift
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Ambient Field Rejection
      3. 8.3.3 High-Precision Signal Chain
        1. 8.3.3.1 Temperature Stability
        2. 8.3.3.2 Lifetime and Environmental Stability
      4. 8.3.4 Internal Reference Voltage
      5. 8.3.5 Current-Sensing Measurable Ranges
      6. 8.3.6 Overcurrent Detection
      7. 8.3.7 Sensor Diagnostics
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Total Error Calculation Examples
        1. 9.1.1.1 Room-Temperature Error Calculations
        2. 9.1.1.2 Full-Temperature Range Error Calculations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Device Support
      1. 10.2.1 Development Support
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DVG|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Tape and Reel Information

TMCS1133
Device Package
Type
Package Drawing Pins SPQ Reel
Diameter (mm)
Reel
Width W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TMCS1133A1AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133A2AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133A3AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133A4AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133A5AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B1AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B2AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B3AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B4AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B5AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B7AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133B8AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133C1AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133C2AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133C3AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133C4AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133C5AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133C9AQDVGR SOIC DVG 10 2000 330 16.4 10.75 10.7 2.7 12 16 Q1
TMCS1133
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMCS1133A1AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133A2AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133A3AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133A4AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133A5AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B1AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B2AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B3AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B4AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B5AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B7AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133B8AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133C1AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133C2AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133C3AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133C4AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133C5AQDVGR SOIC DVG 10 2000 350 350 43
TMCS1133C9AQDVGR SOIC DVG 10 2000 350 350 43