SBOS702E October   2014  – September 2021 TMP102-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Digital Temperature Output
      2. 7.3.2  Serial Interface
      3. 7.3.3  Bus Overview
      4. 7.3.4  Serial Bus Address
      5. 7.3.5  Writing and Reading Operation
      6. 7.3.6  Slave Mode Operations
        1. 7.3.6.1 Slave Receiver Mode
        2. 7.3.6.2 Slave Transmitter Mode
      7. 7.3.7  SMBus Alert Function
      8. 7.3.8  General Call
      9. 7.3.9  High-Speed (Hs) Mode
      10. 7.3.10 Time-Out Function
      11. 7.3.11 Timing Diagrams
      12. 7.3.12 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 Shutdown Mode (SD)
      4. 7.4.4 One-Shot and Conversion Ready (OS)
      5. 7.4.5 Thermostat Mode (TM)
        1. 7.4.5.1 Comparator Mode (TM = 0)
        2. 7.4.5.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1 and F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL Bit)
        9. 7.5.3.9 Conversion Rate (CR)
      4. 7.5.4 High-Limit and Low-Limit Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

see the Section 7.3.11 section for additional information
FAST MODEHIGH-SPEED MODEUNIT
MINMAXMINMAX
ƒ(SCL)SCL operating frequencyV+0.0010.40.0012.85MHz
t(BUF)Bus-free time between STOP and START conditionSee Section 7.3.12.600160ns
t(HDSTA)Hold time after repeated START condition.
After this period, the first clock is generated.
600160ns
t(SUSTA)repeated start condition setup time600160ns
t(SUSTO)STOP Condition Setup Time600160ns
t(HDDAT)Data hold time10090025105ns
t(SUDAT)Data setup time10025ns
t(LOW)SCL-clock low periodV+ , see Section 7.3.121300210ns
t(HIGH)SCL-clock high periodSee Section 7.3.1260060ns
tFDData fall timeSee Section 7.3.1230080ns
tRDData rise timeSee Section 7.3.12300ns
SCLK ≤ 100 kHz, see Section 7.3.121000ns
tFCClock fall timeSee Section 7.3.1230040ns
tRCClock rise timeSee Section 7.3.1230040ns