SBOS397I August   2007  – June 2024 TMP102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Digital Temperature Output
      2. 6.3.2  Serial Interface
      3. 6.3.3  Bus Overview
      4. 6.3.4  Serial Bus Address
      5. 6.3.5  Writing and Reading Operation
      6. 6.3.6  Target Mode Operations
        1. 6.3.6.1 Target Receiver Mode
        2. 6.3.6.2 Target Transmitter Mode
      7. 6.3.7  SMBus Alert Function
      8. 6.3.8  General Call
      9. 6.3.9  High-Speed (HS) Mode
      10. 6.3.10 Timeout Function
      11. 6.3.11 Timing Diagrams
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous-Conversion Mode
      2. 6.4.2 Extended Mode (EM)
      3. 6.4.3 Shutdown Mode (SD)
      4. 6.4.4 One-Shot/Conversion Ready (OS)
      5. 6.4.5 Thermostat Mode (TM)
        1. 6.4.5.1 Comparator Mode (TM = 0)
        2. 6.4.5.2 Interrupt Mode (TM = 1)
    5. 6.5 Programming
      1. 6.5.1 Pointer Register
      2. 6.5.2 Temperature Register
      3. 6.5.3 Configuration Register
        1. 6.5.3.1 Shutdown Mode (SD)
        2. 6.5.3.2 Thermostat Mode (TM)
        3. 6.5.3.3 Polarity (POL)
        4. 6.5.3.4 Fault Queue (F1/F0)
        5. 6.5.3.5 Converter Resolution (R1/R0)
        6. 6.5.3.6 One-Shot (OS)
        7. 6.5.3.7 EM Bit
        8. 6.5.3.8 Alert (AL Bit)
        9. 6.5.3.9 Conversion Rate (CR)
      4. 6.5.4 High- and Low-Limit Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision H (December 2018) to Revision I (June 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Changed all instances of legacy terminology to controller and target where I2C is mentioned Go
  • Changed the "Conversion time" throughout the documentGo
  • Changed the active, shutdown, average, and delay quiescent current throughout the documentGo
  • Changed the SCL pin description in Pin Functions tableGo
  • Removed machine model (MM) from ESD Ratings section.Go
  • Changed DRL package Thermal Information section.Go
  • Changed "Conversion time" in Electrical Characteristics table.Go
  • Added Average quiescent current at 1Hz conversion mode in Electrical Characteristics table.Go
  • Changed Average quiescent current at 4Hz conversion mode in Electrical Characteristics table.Go
  • Changed Average quiescent current when serial bus active, SCL frequency = 400 kHz in Electrical Characteristics table.Go
  • Changed Average quiescent current when serial bus active, SCL frequency = 2.85MHz in Electrical Characteristics table.Go
  • Changed the frequency from 3.4 to 2.85 MHz in the POWER SUPPLY section of the Electrical Characteristics table.Go
  • Changed shutdown current for both serial bus inactive and active, SCL frequency = 400 kHz in Electrical Characteristics table.Go
  • Changed shutdown current when serial bus active, SCL frequency = 2.85 MHz in Electrical Characteristics table.Go
  • Changed Average Quiescent Current vs Temperature, Shutdown Current vs Temperature, Conversion Time vs Temperature, and Quiescent Current vs Bus Frequency graphs in the Typical Characteristics sectionGo
  • Changed the Interrupt Mode (TM=1) sectionGo

Changes from Revision G (September 2018) to Revision H (December 2018)

  • Changed Absolute Maximum Ratings for voltage at SCL, SDA and ADD0 pinGo
  • Changed Absolute Maximum Ratings for voltage at ALERT pinGo

Changes from Revision F (September 2018) to Revision G (November 2018)

  • Changed input voltage maximum value from: 3.6V to: 4V.Go
  • Changed output voltage maximum value from: 3.6V to: ((V+) + 0.5) and ≤ 4V.Go
  • Changed Junction-to-ambient thermal resistance from 200 °C/W to 210.3 °C/WGo
  • Changed Junction-to-case (top) thermal resistance from 73.7 °C/W to 105.0 °C/W.Go
  • Changed Junction-to-board thermal resistance from 34.4 °C/W to 87.5 °C/W.Go
  • Changed Junction-to-top characterization parameter from 3.1 °C/W to 6.1 °C/W.Go
  • Changed Junction-to-board characterization parameter from 34.2 °C/W to 87.0 °C/W.Go
  • Added the Receiving Notification of Documentation Updates section.Go

Changes from Revision E (April 2015) to Revision F (December 2015)

  • Added TI Design Go
  • Added NIST Features bullet Go
  • Added last paragraph of Description section Go

Changes from Revision D (September 2014) to Revision E (December 2014)

  • Changed the Temperature Error vs Temperature graph in the Typical Characteristics sectionGo
  • Changed the Temperature Error at 25°C graph in the Typical Characteristics sectionGo

Changes from Revision C (October 2012) to Revision D (September 2014)

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed parameters in Timing Requirements. Go

Changes from Revision B (October 2008) to Revision C (October 2012)

  • Changed DRL package Thermal Information section.Go
  • Changed "Conversion time" in Electrical Characteristics table.Go
  • Changed values for Data Hold Time parameter in Timing Requirements Go