SBOS545D February   2011  – December 2018 TMP103

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 One-Shot Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  Temperature Watchdog Function
      2. 7.5.2  Conversion Rate
      3. 7.5.3  Shutdown Mode (M1 = 0, M0 = 0)
      4. 7.5.4  One-Shot (M1 = 0, M0 = 1)
      5. 7.5.5  Continuous Conversion Mode (M1 = 1)
      6. 7.5.6  Bus Overview
      7. 7.5.7  Serial Interface
      8. 7.5.8  Serial Bus Address
      9. 7.5.9  Writing and Reading Operation
      10. 7.5.10 Slave Mode Operations
        1. 7.5.10.1 Slave Receiver Mode
        2. 7.5.10.2 Slave Transmitter Mode
      11. 7.5.11 General Call
      12. 7.5.12 High-Speed (Hs) Mode
      13. 7.5.13 Timeout Function
      14. 7.5.14 Multiple Device Access
        1. 7.5.14.1 Multiple Device Access Write
        2. 7.5.14.2 Multiple Device Access Read
      15. 7.5.15 NOISE
    6. 7.6 Register Maps
      1. 7.6.1 Pointer Register
      2. 7.6.2 Temperature Register
      3. 7.6.3 Configuration Register
      4. 7.6.4 Temperature Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.3 Application Curve

Table 9 shows the step response of the TMP103 device to a submersion in an oil bath of 100ºC from room temperature (25ºC). The time-constant, or the time for the output to reach 63% of the input step, is 1.4 s. The time-constant result depends on the printed-circuit-board (PCB) that the TMP103 device is mounted. For this test, there are eight TMP103 devices soldered to a two-layer PCB that measured 2 in × 2 in, and the PCB thickness is 64 mils.

TMP103 D001_SBOS545.gifFigure 17. Temperature vs Time